The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Oct. 15, 2018
International Business Machines Corporation, Armonk, NY (US);
Shidong Li, Poughkeepsie, NY (US);
Kirk D. Peterson, Jericho, VT (US);
Nicolas Pizzuti, Waterbury, VT (US);
Thomas M. Shaw, Peekskill, NY (US);
Thomas A. Wassick, LaGrangeville, NY (US);
INTERNATIONAL BUSINESS MACHINES CORPORATION, Armonk, NY (US);
Abstract
A semiconductor device which includes a substrate having integrated circuits; and metallization layers on the substrate, the metallization layers having a peripheral region adjacent to a kerf region of the semiconductor device and containing a crack stop structure. The crack stop structure includes a bottom portion containing a plurality of the metallization layers connected by vias with each metallization layer decreasing in width in a step pyramid structure from a bottom of the bottom portion to a top of the bottom portion; and a top portion containing a top metallization layer of the metallization layers connected to the bottom portion, the top metallization layer being wider than a top-most metallization layer of the bottom portion and having a segment that extends toward the kerf region so as to create an overhang with respect to the bottom portion.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile