The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Jun. 26, 2018
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Kean Huat Leong, Georgetown, MY;
Chun Kit See, Bayan Lepas, MY;
Sheng Jian Darren Tan, Penang, MY;
Paik Wen Ong, Taiping, MY;
Eng Huat Goh, Penang, MY;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/4853 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19106 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.