The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2020
Filed:
Nov. 28, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/433 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4882 (2013.01); H01L 21/4878 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 23/3731 (2013.01); H01L 23/3738 (2013.01); H01L 23/4334 (2013.01); H01L 24/17 (2013.01); H01L 24/92 (2013.01); H01L 24/94 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/17181 (2013.01); H01L 2224/17519 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81 (2013.01); H01L 2224/83 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06565 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/05432 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15738 (2013.01); H01L 2924/15787 (2013.01);
Abstract
Methods for forming semiconductor die assemblies with heat transfer features are disclosed herein. In some embodiments, the methods comprise providing a wafer having a first side and a second side opposite the first side, attaching a semiconductor die stack to the first side of the wafer, and forming a plurality of heat transfer features at the second side of the wafer. The heat transfer features can be defined by a plurality of grooves that define an exposed continuous surface of the wafer at the second side compared to a planar surface of the wafer.