The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

May. 04, 2018
Applicant:

Canon Anelva Corporation, Kawasaki-shi, JP;

Inventors:

Koji Tsunekawa, Kawasaki, JP;

Masahiro Suenaga, Kawasaki, JP;

Takeo Konno, Kawasaki, JP;

Assignee:

CANON ANELVA CORPORATION, Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/34 (2006.01); C23C 14/34 (2006.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01); G11B 5/39 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3476 (2013.01); C23C 14/3464 (2013.01); C23C 14/505 (2013.01); C23C 14/54 (2013.01); C23C 14/542 (2013.01); G11B 5/3909 (2013.01); H01J 37/32733 (2013.01); H01J 37/34 (2013.01); H01J 37/3429 (2013.01); H01J 37/3435 (2013.01); H01J 37/3473 (2013.01); G11B 5/3906 (2013.01); H01J 2237/20214 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/332 (2013.01);
Abstract

A sputtering apparatus according to one embodiment of the present invention includes a substrate holder, a cathode unit arranged at a position diagonally opposite to the substrate holder, a position sensor for detecting a rotational position of the substrate, and a holder rotation controller for adjusting a rotation speed of the substrate according to the detected rotational position. The holder rotation controller controls the rotation speed so that the rotation speed of the substrate when the cathode unit is located on a side in a first direction as an extending direction of a process target surface of the relief structure is lower than the rotation speed of the substrate when the cathode unit is located on a side in a second direction which is perpendicular to the first direction along the rotation of the substrate.


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