The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2020

Filed:

Jul. 12, 2018
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hemant P. Mungekar, Campbell, CA (US);

Ganesh Balasubramanian, Fremont, CA (US);

Yoichi Suzuki, Funabashi, JP;

Abdul Aziz Khaja, San Jose, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 37/32 (2006.01); H05B 1/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 21/324 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32724 (2013.01); H01L 21/324 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H01L 21/6833 (2013.01); H01L 22/26 (2013.01); H05B 1/0233 (2013.01); H01J 2237/2001 (2013.01); H01J 2237/24585 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01);
Abstract

A processing chamber and a processing method for processing a substrate in the processing chamber with thermal control are described herein. The method includes heating a first substrate using a heater apparatus during a first processing operation. The heater apparatus has a first setpoint during at least a first portion of the first processing operation. The first substrate is disposed on a substrate support surface of an electrostatic chuck in a processing chamber. The method further includes determining a first parameter change corresponding to a resistivity change in the electrostatic chuck, determining a second setpoint for the heater apparatus based on the first parameter change, and controlling the heater apparatus to the second setpoint.


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