The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

May. 31, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jeffrey P. Gambino, Portland, OR (US);

Mark D. Jaffe, Shelburne, VT (US);

Steven M. Shank, Jericho, VT (US);

Anthony K. Stamper, Williston, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/482 (2006.01); H01L 21/683 (2006.01); H01L 21/74 (2006.01); H01L 21/762 (2006.01); H01L 23/532 (2006.01); H01L 27/12 (2006.01); H01L 29/06 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76895 (2013.01); H01L 21/6835 (2013.01); H01L 21/743 (2013.01); H01L 21/76251 (2013.01); H01L 21/76898 (2013.01); H01L 23/4825 (2013.01); H01L 23/4827 (2013.01); H01L 23/53271 (2013.01); H01L 27/1203 (2013.01); H01L 29/0649 (2013.01); H01L 29/1087 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01);
Abstract

A device structure is formed using a silicon-on-insulator substrate. The device structure includes a first switch and a second switch that are formed within a device layer of the silicon-on-insulator substrate and between a buried insulator layer of the silicon on-insulator substrate and a dielectric layer disposed above and coupled to the device layer. An electrically-conducting connection is located in a first trench extending from the device layer through the buried insulator layer to a trap-rich layer such that the electrically-conducting connection is coupled with a substrate.


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