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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629468 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Feb. 10, 2017

Device packaging using a recyclable carrier substrate

Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Jiro Yota, Westlake Village, CA (US);

Hong Shen, Palo Alto, CA (US);

Viswanathan Ramanathan, Thousand Oaks, CA (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Woburn, MA (US);

Attorney:

Lando & Anastasi, LLP

Primary Examiner:

Seahvosh Nikmanesh

Assistant Examiner:

Xiaoming Liu

Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/58 (2006.01); H03H 9/10 (2006.01); H03H 3/08 (2006.01); H01L 21/683 (2006.01); H01L 23/522 (2006.01); H01L 23/13 (2006.01); H03H 3/007 (2006.01); H03H 3/02 (2006.01); H01L 41/187 (2006.01); H01L 41/053 (2006.01); H01L 41/25 (2013.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/76802 (2013.01); H01L 23/13 (2013.01); H01L 23/5226 (2013.01); H01L 23/585 (2013.01); H03H 3/0072 (2013.01); H03H 3/02 (2013.01); H03H 3/08 (2013.01); H03H 9/1014 (2013.01); H03H 9/1057 (2013.01); H03H 9/1071 (2013.01); H01L 21/6836 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 41/053 (2013.01); H01L 41/1873 (2013.01); H01L 41/25 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/11 (2013.01);
Abstract

According to various aspects and embodiments, a method for forming a packaged electronic device is provided. In accordance with one embodiment, the method comprises depositing a layer of temporary adhesive material on at least a portion of a surface of a first substrate having a coefficient of thermal expansion, depositing a layer of dielectric material on at least a portion of the layer of temporary adhesive material, forming at least one seal ring on at least a portion of the layer of dielectric material, providing a second substrate having a coefficient of thermal expansion that is substantially the same as the coefficient of thermal expansion of the first substrate, the second substrate having at least one bonding structure attached to a surface of the second substrate, and aligning the at least one seal ring to the at least one bonding structure and bonding the first substrate to the second substrate.

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