The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Apr. 08, 2016
Applicants:

The Trustees of Columbia University IN the City of New York, New York, NY (US);

James S. Im, New York, NY (US);

Miao Yu, New York, NY (US);

Inventors:

James S. Im, New York, NY (US);

Miao Yu, New York, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B23K 26/03 (2006.01); B23K 26/0622 (2014.01); B23K 26/354 (2014.01); H01L 21/321 (2006.01); H01L 21/302 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01); B23K 103/08 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02686 (2013.01); B23K 26/03 (2013.01); B23K 26/0622 (2015.10); B23K 26/0624 (2015.10); B23K 26/354 (2015.10); H01L 21/02074 (2013.01); H01L 21/02532 (2013.01); H01L 21/02587 (2013.01); H01L 21/02595 (2013.01); H01L 21/302 (2013.01); H01L 21/32115 (2013.01); B23K 2101/40 (2018.08); B23K 2103/08 (2018.08); B23K 2103/56 (2018.08);
Abstract

A method for planarizing excimer laser annealed (ELA) polycrystalline thin films via irradiation. The method includes providing an ELA thin film having an oxide and a top surface with a first surface roughness defined at least by a first plurality of protrusions. The ELA thin film is etched to substantially remove the oxide. At least a portion of the etched ELA thin film is then irradiated using a short-pulse duration excimer laser beam, to form an irradiated thin film with a second surface roughness defined at least by a second plurality of protrusions. The second surface roughness is lower than the first surface roughness.


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