The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
May. 17, 2017
Applicant:
Tdk Electronics Ag, München, DE;
Inventor:
Martin Neudecker, München, DE;
Assignee:
TDK ELECTRONICS AG, München, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/08 (2006.01); H01F 27/32 (2006.01); H01F 41/10 (2006.01); H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 41/12 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01F 17/06 (2006.01);
U.S. Cl.
CPC ...
H01F 27/08 (2013.01); H01F 27/022 (2013.01); H01F 27/085 (2013.01); H01F 27/2823 (2013.01); H01F 27/325 (2013.01); H01F 41/10 (2013.01); H01F 41/127 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H01F 17/062 (2013.01); H05K 2201/1003 (2013.01);
Abstract
An inductive component having a coil with a winding of a wire and a molded body adhering to the coil. The molded body has a surface for the arrangement of a heat sink. A method for producing such a component is also specified, in which, to produce the molded body, a mold is filled with a potting material and the mold is subsequently removed.