The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Jul. 29, 2016
Applicant:

Showa Denko K.k., Tokyo, JP;

Inventors:

Takashi Aigo, Tokyo, JP;

Wataru Ito, Tokyo, JP;

Tatsuo Fujimoto, Tokyo, JP;

Assignee:

SHOWA DENKO K.K., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C30B 29/36 (2006.01); H01L 29/161 (2006.01); H01L 21/02 (2006.01); C30B 25/02 (2006.01); C30B 25/16 (2006.01); C30B 25/18 (2006.01); C30B 23/02 (2006.01);
U.S. Cl.
CPC ...
C30B 29/36 (2013.01); C30B 23/025 (2013.01); C30B 25/02 (2013.01); C30B 25/165 (2013.01); C30B 25/186 (2013.01); H01L 21/0262 (2013.01); H01L 21/02378 (2013.01); H01L 21/02433 (2013.01); H01L 21/02529 (2013.01); H01L 21/02661 (2013.01); H01L 29/161 (2013.01);
Abstract

A method for producing an epitaxial silicon carbide single crystal wafer comprised of a silicon carbide single crystal substrate having a small off angle on which a high quality silicon carbide single crystal film with little basal plane dislocations is provided, that is, a method for producing an epitaxial silicon carbide single crystal wafer epitaxially growing silicon carbide on a silicon carbide single crystal substrate using a thermal CVD method, comprising supplying an etching gas inside the epitaxial growth reactor to etch the surface of the silicon carbide single crystal substrate so that the arithmetic average roughness Ra value becomes 0.5 nm to 3.0 nm, then starting epitaxial growth to convert 95% or more of the basal plane dislocations at the surface of the silicon carbide single crystal substrate to threading edge dislocations.


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