The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 2020

Filed:

Dec. 18, 2013
Applicant:

Polymatech Japan Co., Ltd., Saitama, Saitama, JP;

Inventors:

Gaku Kitada, Saitama, JP;

Yasuyoshi Watanabe, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/08 (2006.01); H01L 23/373 (2006.01); C08L 101/00 (2006.01); C08L 83/04 (2006.01); H01L 23/42 (2006.01); C10M 169/02 (2006.01); C10M 171/02 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); H01L 21/48 (2006.01); C08G 77/20 (2006.01); C08G 77/12 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
C09K 5/08 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08L 83/04 (2013.01); C08L 101/00 (2013.01); C10M 169/02 (2013.01); C10M 171/02 (2013.01); H01L 21/4871 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08K 2003/2227 (2013.01); C08K 2201/001 (2013.01); C10M 2201/0626 (2013.01); C10M 2229/0435 (2013.01); C10N 2210/03 (2013.01); C10N 2220/082 (2013.01); C10N 2230/08 (2013.01); C10N 2240/20 (2013.01); C10N 2250/10 (2013.01); H01L 23/4006 (2013.01); H01L 2924/0002 (2013.01); Y02P 20/582 (2015.11);
Abstract

A curable thermally conductive greasecontains a curable liquid polymer, a thermally conductive filler (A) having an average particle diameter of less than 10 μm, and a thermally conductive filler (B) having an average particle diameter of 10 μm or more, the ratio by volume of the thermally conductive filler (A) to the thermally conductive filler (B), i.e., (A)/(B), being 0.65 to 3.02, and the curable thermally conductive grease having a viscosity of 700 Pa·s to 2070 Pa·s, in which after the curable thermally conductive grease is applied to the heat-generating body or the heat-dissipating body to a thickness of 5 mm, the curable thermally conductive grease has slump resistance in which the curable thermally conductive grease does not flow down when the heat-generating body or the heat-dissipating body is vertically arranged.


Find Patent Forward Citations

Kitada, Gaku. (2020). Curable thermally conductive grease, heat dissipation structure, and method for producing heat dissipation structure (U.S. Patent No. 10626311). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10626311

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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