The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

May. 09, 2019
Applicant:

Suzhou Han Hua Semiconductor Co., Ltd, Suzhou, CN;

Inventors:

Xianfeng Ni, Suzhou, CN;

Qian Fan, Suzhou, CN;

Wei He, Suzhou, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/308 (2006.01); H01L 21/311 (2006.01); H01L 21/265 (2006.01); H01L 29/06 (2006.01); H01L 29/778 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66462 (2013.01); H01L 21/26546 (2013.01); H01L 21/308 (2013.01); H01L 21/31116 (2013.01); H01L 29/0603 (2013.01); H01L 29/778 (2013.01);
Abstract

The present application provides a semiconductor device and a method for manufacturing the same. The method includes: sequentially forming a buffer layer and a barrier layer on a substrate, wherein a two-dimensional electron gas is formed between the buffer layer and the barrier layer; etching a source region and a drain region of the barrier layer to form a trench on the buffer layer, and doped layers are formed on the trench; forming a passivation layer on the barrier layer and the doped layers, and etching the passivation layer to expose a portion of the barrier layer, wherein the portion of the barrier layer is in contact with the doped layers; and doping ions into a portion of the buffer layer in contact with the portion of the buffer layer.


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