The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Jul. 17, 2019
Hamamatsu Photonics K.k., Hamamatsu-shi, Shizuoka, JP;
HAMAMATSU PHOTONICS K.K., Hamamatsu-shi, Shizuoka, JP;
Abstract
A method of manufacturing a semiconductor device includes a first process in which a first wiringis provided on a first surfacea of a semiconductor substrate; a second process in which a light transmitting substrateis attached to the first surfacea; a third process in which the semiconductor substrateis thinned so that the thickness of the semiconductor substrateis smaller than the thickness of the light transmitting substrate; a fourth process in which a through holeis formed in the semiconductor substrate; a fifth process in which a dip coating method is performed using a first resin material and thus a resin insulating layeris provided; a sixth process in which a contact holeis formed in the resin insulating layer; and a seventh process in which a second wiringis provided on a surfaceb of the resin insulating layer, and the first wiringand the second wiringare electrically connected via a contact hole