The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 2020
Filed:
Nov. 20, 2018
Epistar Corporation, Hsinchu, TW;
Shih-An Liao, Hsinchu, TW;
Shau-Yi Chen, Hsinchu, TW;
Ming-Chi Hsu, Hsinchu, TW;
Chun-Hung Liu, Hsinchu, TW;
Min-Hsun Hsieh, Hsinchu, TW;
EPISTAR CORPORATION, Hsinchu, TW;
Abstract
A semiconductor device comprises a semiconductor die, comprising a stacking structure, a first bonding pad with a first bonding surface positioned away from the stacking structure, and a second bonding pad; a carrier comprising a connecting surface; a third bonding pad which comprises a second bonding surface and is arranged on the connecting surface, and a fourth bonding pad arranged on the connecting surface; and a conductive connecting layer comprising a first conducting part, comprising a first outer boundary, and formed between and directly contacting the first bonding pad and the third bonding pad; a second conducting part formed between the second bonding pad and the fourth bonding pad; and a blocking part covering the first conducting part.