The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Jan. 05, 2018
Applicant:

Toshiba Memory Corporation, Minato-ku, JP;

Inventors:

Shigeki Kobayashi, Kuwana, JP;

Masaru Kito, Kuwana, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11582 (2017.01); H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 27/11556 (2017.01); H01L 27/11565 (2017.01); H01L 27/11575 (2017.01); H01L 27/1157 (2017.01);
U.S. Cl.
CPC ...
H01L 23/528 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 27/1157 (2013.01); H01L 27/11556 (2013.01); H01L 27/11565 (2013.01); H01L 27/11575 (2013.01); H01L 27/11582 (2013.01);
Abstract

According to one embodiment, a stacked body includes a plurality of conductive layers stacked with an insulator interposed. The stacked body includes a first stacked portion and a second stacked portion. The second stacked portion includes a plurality of terrace portions arranged in a staircase configuration with level differences in a first direction and a second direction. The second stacked portion includes a conductive portion and a spacer portion. The conductive portion is connected to the conductive layer and is provided in same layer as the conductive layer. The spacer portion is provided in same layer as the conductive layer and the conductive portion. The spacer portion is of a material different from the conductive portion.


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