The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Jan. 30, 2018
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Tsung-Sheng Kuo, New Taipei, TW;

Yang-Ann Chu, Hsin-Chu, TW;

Alan Yang, Hsin-Chu, TW;

Vic Huang, Hsin-Chu, TW;

Hsu-Shui Liu, Pingjhen, TW;

Jiun-Rong Pai, Jhubei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/677 (2006.01); H01L 21/68 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/677 (2013.01); H01L 21/67733 (2013.01); H01L 21/67736 (2013.01); H01L 21/67772 (2013.01); H01L 21/681 (2013.01); H01L 21/683 (2013.01);
Abstract

An apparatus for handling wafer carriers in a semiconductor fabrication facility (FAB) is disclosed. In one example, the apparatus includes: a table configured to receive a wafer carrier having a first door and operable to hold a plurality of wafers; an opening mechanism configured to open the first door of the wafer carrier; and a door storage space configured to store the first door. The apparatus may be either located on a floor of the FAB or physically coupled to a ceiling of the FAB.


Find Patent Forward Citations

Loading…