The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Nov. 03, 2015
Applicants:

Melexis Technologies NV, Tessenderlo, BE;

X-celeprint Limited, Dublin, IE;

Inventors:

Christian Schott, Lussy-sur-Morges, CH;

Matthew Meitl, Durham, NC (US);

Christopher Bower, Raleigh, NC (US);

Assignees:

MELEXIS TECHNOLOGIES NV, Tessenderlo, BE;

X-CELEPRINT LIMITED, Dublin, IE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/07 (2006.01); H01L 43/04 (2006.01); H01L 23/00 (2006.01); G01R 33/00 (2006.01);
U.S. Cl.
CPC ...
G01R 33/07 (2013.01); G01R 33/0052 (2013.01); G01R 33/077 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 24/94 (2013.01); H01L 43/04 (2013.01); H01L 2224/24146 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/92137 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/94 (2013.01); H01L 2224/97 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/181 (2013.01);
Abstract

A semiconductor chip for measuring a magnetic field. The semiconductor chip comprises a magnetic sensing element, and an electronic circuit. The magnetic sensing element is mounted on the electronic circuit. The magnetic sensing element is electrically connected with the electronic circuit. The electronic circuit is produced in a first technology and/or first material and the magnetic sensing element is produced in a second technology and/or second material different from the first technology/material.


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