The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 14, 2020

Filed:

Dec. 14, 2016
Applicant:

Atotech Deutschland Gmbh, Berlin, DE;

Inventors:

Fabian Michalik, Berlin, DE;

Norbert Lützow, Berlin, DE;

Josef Gaida, Berlin, DE;

Thomas Hülsmann, Berlin, DE;

Gabriela Schmidt, Berlin, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F 1/18 (2006.01); H05K 3/06 (2006.01); H05K 3/38 (2006.01); H01L 21/3213 (2006.01); C23F 1/02 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01); C09K 13/06 (2006.01);
U.S. Cl.
CPC ...
C23F 1/18 (2013.01); C23F 1/02 (2013.01); H01L 21/32134 (2013.01); H01L 21/76838 (2013.01); H01L 23/53228 (2013.01); H01L 23/53233 (2013.01); H05K 3/067 (2013.01); H05K 3/383 (2013.01); C09K 13/06 (2013.01); H01L 21/32139 (2013.01); H05K 2203/0789 (2013.01); H05K 2203/0796 (2013.01);
Abstract

An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each Ris a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.


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