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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10616992 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Dec. 20, 2017

Circuit board and method for manufacturing the same

Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Yin-Ju Chen, Taoyuan, TW;

Ming-Hao Wu, Taoyuan, TW;

Cheng-Po Yu, Taoyuan, TW;

Assignee:

UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;

Attorney:

CKC & Partners Co., LLC

Primary Examiner:

Livius R Cazan

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 35/30 (2006.01); H01L 23/13 (2006.01); H01L 23/427 (2006.01); G06F 1/20 (2006.01); H01L 23/498 (2006.01); H05K 1/11 (2006.01); H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); G06F 1/206 (2013.01); H01L 23/12 (2013.01); H01L 23/13 (2013.01); H01L 23/4275 (2013.01); H01L 23/49827 (2013.01); H01L 35/30 (2013.01); H05K 1/0206 (2013.01); H05K 1/113 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 1/187 (2013.01); H05K 3/4647 (2013.01); H05K 3/4697 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15313 (2013.01); H05K 2201/048 (2013.01); H05K 2201/10219 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10515 (2013.01); H05K 2201/10734 (2013.01);
Abstract

A circuit board with a heat-recovery function includes a substrate, a heat-storing device, and a thermoelectric device. The heat-storing device is embedded in the substrate and connected to a processor for performing heat exchange with the processor. The thermoelectric device embedded in the substrate includes a first metal-junction surface and a second metal-junction surface. The first metal-junction surface is connected to the heat-storing device for performing heat exchange with the heat-storing device. The second metal-junction surface is joined with the first metal-junction surface, in which the thermoelectric device generates an electric potential by a temperature difference between the first metal-junction surface and the second metal-junction surface.

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