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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10615130 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Nov. 29, 2018

Devices and methods for isolating signals in semiconductor devices

Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventor:

Walter Parmon, Chandler, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:

Mary Jo Bertani

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 23/49811 (2013.01);
Abstract

A packaged semiconductor device includes a substrate having a ground plane, a first communication port on the substrate, a second communication port on the substrate adjacent the first communication port, and grounding structures on the substrate. Each of the grounding structures is in contact with two different locations on the ground plane and is adjacent to one of the first and second communication ports. An electrically insulating material completely covers a top side of each of the grounding structures.

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Parmon, Walter. (2020). Devices and methods for isolating signals in semiconductor devices (U.S. Patent No. 10615130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10615130

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