The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Nov. 21, 2017
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventor:
Shih-Liang Cheng, New Taipei, TW;
Assignee:
UNIMICRON TECHNOLOGY CORP., Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H01L 21/48 (2006.01); H05K 3/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4846 (2013.01); H05K 3/107 (2013.01); H05K 3/108 (2013.01); H05K 3/188 (2013.01); H05K 2201/0341 (2013.01); H05K 2203/0588 (2013.01); H05K 2203/1383 (2013.01);
Abstract
A method for manufacturing conductive lines is provided. A first metal layer is formed over a carrier substrate. A second metal layer is formed over the first metal layer. A plurality of first conductive lines is formed on the second metal layer. A protective layer is formed on opposite sidewalls of the first conductive lines. An exposed portion of the second metal layer is removed to expose a portion of the first metal layer. The exposed portion of the first metal layer is removed, and the protective layer is removed.