The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Oct. 18, 2018
Applicant:

Asm Technology Singapore Pte Ltd, Singapore, SG;

Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/304 (2006.01); H01L 21/67 (2006.01); B23K 26/364 (2014.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3043 (2013.01); B23K 26/364 (2015.10); H01L 21/67092 (2013.01); B23K 2101/40 (2018.08);
Abstract

A method of cutting a semiconductor material by irradiating the semiconductor material with laser energy, includes providing a laser source adapted to emit successive pulses of laser beams, each laser beam pulse having a pulse width of 100 picoseconds or less, emitting laser beam pulses from the laser source, guiding the emitted laser beam pulses to irradiate semiconductor material to be cut, and moving the semiconductor material relative to the irradiating laser beam pulses to cut the semiconductor material along a cutting line. The semiconductor material is irradiated by a plurality of laser beam pulses with a pulse repetition frequency in the range from 0.1 GHz to 5000 GHz.


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