The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 2020

Filed:

Feb. 23, 2016
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Woon Chul Choi, Suwon-si, KR;

Myung Jun Park, Suwon-si, KR;

Hye Min Bang, Suwon-si, KR;

Jun Ah, Suwon-si, KR;

Myung Sam Kang, Suwon-si, KR;

Jung Hyuk Jung, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01L 27/08 (2006.01); H01F 17/00 (2006.01); H01F 27/255 (2006.01); H01F 41/04 (2006.01);
U.S. Cl.
CPC ...
H01F 17/0013 (2013.01); H01F 27/255 (2013.01); H01F 41/046 (2013.01);
Abstract

A multilayer seed pattern inductor includes a magnetic body and an internal coil part. The magnetic body contains a magnetic material. The internal coil part is embedded in the magnetic body and includes connected coil conductors disposed on two opposing surfaces of an insulating substrate. Each of the coil conductors includes a seed pattern formed of at least two layers, a surface coating layer covering the seed pattern, and an upper plating layer formed on an upper surface of the surface coating layer.


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