The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Mar. 25, 2019
Asml Netherlands B.v., Veldhoven, NL;
Marc Hauptmann, Leuven, BE;
Dylan John David Davies, Heeswijk-Dinter, NL;
Paul Janssen, Eindhoven, NL;
Naoko Tsugama, Moergestel, NL;
Richard Joseph Bruls, Eindhoven, NL;
Kornelis Tijmen Hoekerd, Eindhoven, NL;
Edwin Johannes Maria Janssen, Helmond, NL;
Petrus Johannes Van Den Oever, Eindhoven, NL;
Ronald Van Der Wilk, Knegsel, NL;
Antonius Hubertus Van Schijndel, Deurne, NL;
Jorge Alberto Vieyra Salas, Eindhoven, NL;
ASML Netherlands B.V., Veldhoven, NL;
Abstract
A diagnostic apparatus monitors a lithographic manufacturing system. First measurement data representing local deviations of some characteristic across a substrate is obtained using sensors within a lithographic apparatus, and/or a separate metrology tool. Other inspection tools perform substrate backside inspection to produce second measurement data. A high-resolution backside defect image is processed into a form in which it can be compared with lower resolution information from the first measurement data. Cross-correlation is performed to identify which of the observed defects are correlated spatially with the deviations represented in the first measurement data. A correlation map is used to identify potentially relevant clusters of defects in the more detailed original defect map. The responsible apparatus can be identified by pattern recognition as part of an automated root cause analysis. Alternatively, reticle inspection data may be used as second measurement data.