The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
Oct. 22, 2018
Applicant:
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventor:
Ravi Pokhrel, Framingham, MA (US);
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 5/02 (2006.01); C25D 7/00 (2006.01); H05K 3/18 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 21/288 (2006.01); H01L 21/027 (2006.01); H05K 3/10 (2006.01); H05K 1/09 (2006.01); H01L 23/532 (2006.01); C25D 7/12 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C25D 5/022 (2013.01); C25D 7/00 (2013.01); H01L 21/0273 (2013.01); H01L 21/2885 (2013.01); H01L 21/76879 (2013.01); H01L 24/03 (2013.01); H05K 3/108 (2013.01); H05K 3/188 (2013.01); H05K 3/4007 (2013.01); C25D 7/123 (2013.01); H01L 23/53228 (2013.01); H01L 2224/03001 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/05147 (2013.01); H05K 1/09 (2013.01); H05K 2203/0723 (2013.01);
Abstract
Copper electroplating compositions which include a diimidazole compound enables the electroplating of copper having uniform morphology on substrates. The composition and methods of enable copper electroplating of photoresist defined features. Such features include pillars, bond pads and line space features.