The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2020
Filed:
May. 18, 2017
Fudan University, Shanghai, CN;
Shijin Ding, Shanghai, CN;
Yongping Wang, Shanghai, CN;
Anan Zuo, Shanghai, CN;
Wei Zhang, Shanghai, CN;
Fudan University, Shanghai, CN;
Abstract
A method and corresponding reactor for depositing metal-nitride thin film with adjustable metal contents. The method includes several first and second half reaction process. By adjusting the ratio of first and second half reaction cycles, metal nitride thin films with different metal contents can be grown. The first half reaction process is the decomposition of metal-organic precursor adsorbed on the substrate surface, leaving behind metal atom layer by light irradiation. The second half reaction process forms metal nitride thin films by the reaction of NHplasma and the metal atomic layer on the substrate surface. This method can control the ratio between metal and nitrogen atom content in the film, thus achieving the regulation of film resistivity. In addition, this method offers favorable film step coverage and accurate film thickness control capability, which is significantly applicable for the film meeting the requirement of advanced CMOS integrated circuit technology.