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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10611934 B1

PDFFull Text
Date of Patent:
Apr. 07, 2020

Filed:

Dec. 21, 2016

Permanent adhesive composition for image sensors, and bonding method and laminate using same

Applicants:

Tokyo Ohka Kogyo Co., Ltd., Kawasaki-shi, JP;

Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;

Inventors:

Tokunori Yamadaya, Kawasaki, JP;

Hiroaki Takeuchi, Kawasaki, JP;

Masatoshi Maeda, Kawasaki, JP;

Kentaro Hayashi, Fukuoka, JP;

Masayoshi Isozaki, Fukuoka, JP;

Assignees:

TOKYO OHKA KOGYO CO., LTD., Kawasaki-Shi, JP;

NIPPON STEEL CHEMICAL & MATERIAL CO., LTD., Tokyo, JP;

Attorney:

Knobbe, Martens, Olson & Bear LLP

Primary Examiner:

Sheeba Ahmed

Int. Cl.
CPC ...
B32B 7/12 (2006.01); C09J 133/10 (2006.01); C09J 133/08 (2006.01); C09J 5/00 (2006.01); C09J 133/04 (2006.01); C09J 11/06 (2006.01); C09J 151/00 (2006.01); C09J 133/14 (2006.01); C09J 125/10 (2006.01); C08K 5/13 (2006.01); C08F 220/18 (2006.01); C08F 265/06 (2006.01); B32B 17/06 (2006.01); B32B 27/30 (2006.01); H01L 27/14 (2006.01); C08K 5/00 (2006.01);
U.S. Cl.
CPC ...
C09J 133/10 (2013.01); B32B 7/12 (2013.01); B32B 17/064 (2013.01); B32B 27/308 (2013.01); C08F 220/18 (2013.01); C08F 265/06 (2013.01); C09J 11/06 (2013.01); C09J 125/10 (2013.01); C09J 133/08 (2013.01); C09J 133/14 (2013.01); C09J 151/00 (2013.01); B32B 2405/00 (2013.01); C08K 5/005 (2013.01); C08K 5/13 (2013.01); H01L 27/14 (2013.01);
Abstract

A permanent adhesive composition for image sensors which provides an adhesive layer having excellent heat resistance and thermal shock resistance, and a bonding method and laminate using the permanent adhesive composition. The permanent adhesive composition for image sensors contains a thermosetting or photocurable resin containing a specific bifunctional (meth)acrylic acid ester-derived structural unit, a polymerizable monomer, and an antioxidant, and used to bond together a substrate and a support for the substrate. The bonding method includes bonding together a substrate and a support for the substrate using the permanent adhesive composition. The laminate is provided with a substrate, a support for the substrate, and an adhesive layer for bonding the substrate and the support together, and the adhesive layer is formed of the permanent adhesive composition.

Find Patent Forward Citations

Yamadaya, Tokunori. (2020). Permanent adhesive composition for image sensors, and bonding method and laminate using same (U.S. Patent No. 10611934). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10611934

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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