The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Feb. 23, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Arvind Sundaram, Bangalore, IN;

Ramaswamy Parthasarathy, Bangalore, IN;

Ranjul Balakrishnan, Bangalore, IN;

Vikas Mishra, Bangalore, IN;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/10 (2006.01); H01R 13/7193 (2011.01); H01R 43/24 (2006.01); H01Q 13/26 (2006.01); H01R 13/6477 (2011.01); H01P 5/08 (2006.01); H01P 1/36 (2006.01); H01P 11/00 (2006.01); H01Q 1/38 (2006.01); H01Q 1/42 (2006.01); H01Q 1/48 (2006.01); H01Q 13/02 (2006.01); H01R 4/18 (2006.01); H01R 13/24 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01P 3/10 (2013.01); H01P 1/36 (2013.01); H01P 5/08 (2013.01); H01P 5/085 (2013.01); H01P 11/001 (2013.01); H01Q 1/38 (2013.01); H01Q 1/42 (2013.01); H01Q 1/48 (2013.01); H01Q 13/02 (2013.01); H01Q 13/26 (2013.01); H01R 4/18 (2013.01); H01R 13/24 (2013.01); H01R 13/6477 (2013.01); H01R 13/7193 (2013.01); H01R 43/24 (2013.01); H05K 1/183 (2013.01);
Abstract

Embodiments of the present disclosure provide techniques and configurations for a cable assembly for single wire communications (SWC). In one instance, the cable assembly may comprise a wire having a wire end to couple with a signal launcher of an electronic device, and a first cover portion to house a first portion of the wire that extends from the wire end. The first cover portion may comprise a shape to conform to a shape of the signal launcher, and may be fabricated of a material with a dielectric constant above a threshold. The assembly may further comprise a second cover portion coupled with the first cover portion to house a second portion of the wire that extends from the first wire portion and protrudes from the first cover portion. The second cover portion may be fabricated of a ferrite material. Other embodiments may be described and/or claimed.


Find Patent Forward Citations

Loading…