The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2020
Filed:
Jun. 15, 2018
Applicant:
Nuflare Technology, Inc., Yokohama-shi, JP;
Inventors:
Kazuhiro Chiba, Sagamihara, JP;
Yoshikuni Goshima, Yokohama, JP;
Shinsuke Nabeya, Chuo-ku, JP;
Shiro Okada, Sagamihara, JP;
Kentaro Mori, Fujisawa, JP;
Assignee:
NuFlare Technology, Inc., Yokohama-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/16 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01); H01J 37/147 (2006.01); H01L 23/14 (2006.01); H01L 29/06 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/16 (2013.01); H01J 37/147 (2013.01); H01L 23/145 (2013.01); H01L 23/15 (2013.01); H01L 23/562 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 29/06 (2013.01); H01L 23/13 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48227 (2013.01);
Abstract
A semiconductor device according to an embodiment includes a semiconductor chip including a region having through holes; a substrate having a first opening larger than the region, the substrate containing a resin or a ceramic; a spacer provided between the semiconductor chip and the substrate, the spacer having a second opening larger than the region; a first bond provided between the semiconductor chip and the spacer; and a second bond provided between the spacer and the substrate.