The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Jul. 12, 2017
Applicant:

Toto Ltd., Kitakyushu-shi, Fukuoka, JP;

Inventors:

Kengo Maehata, Fukuoka, JP;

Shumpei Kondo, Fukuoka, JP;

Hitoshi Sasaki, Fukuoka, JP;

Kosuke Yamaguchi, Fukuoka, JP;

Yuichi Yoshii, Fukuoka, JP;

Assignee:

Toto Ltd., Fukuoka, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05B 3/68 (2006.01); H05B 3/10 (2006.01); H01L 21/683 (2006.01); B23Q 3/15 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H02N 13/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); B23Q 3/15 (2013.01); H01L 21/67103 (2013.01); H01L 21/67109 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01); H02N 13/00 (2013.01);
Abstract

According to one embodiment, an electrostatic chuck includes a ceramic dielectric substrate, a base plate, and a heater plate. The ceramic dielectric substrate has a surface where a processing object is placed. The base plate supports the ceramic dielectric substrate. The heater plate is provided between the ceramic dielectric substrate and the base plate. The heater plate includes a first support plate including a metal, a second support plate including a metal, a heater element, a first resin layer, and a second resin layer. The heater element is provided between the first support plate and the second support plate. The heater element emits heat due to a current flowing. The first resin layer is provided between the first support plate and the heater element. The second resin layer is provided between the second support plate and the heater element.


Find Patent Forward Citations

Loading…