The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2020

Filed:

Jun. 01, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Jahnavi Sharma, Hillsboro, OR (US);

Ganesh Balamurugan, Hillsboro, OR (US);

Hao Li, Portland, OR (US);

Meer Nazmus Sakib, Berkeley, CA (US);

Haisheng Rong, Pleasanton, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/43 (2006.01); H01L 27/146 (2006.01); H04B 10/67 (2013.01); G02B 6/12 (2006.01); H01L 31/12 (2006.01); H01L 31/14 (2006.01); H04B 10/66 (2013.01);
U.S. Cl.
CPC ...
G02B 6/43 (2013.01); G02B 6/12007 (2013.01); H01L 27/14643 (2013.01); H01L 31/12 (2013.01); H01L 31/14 (2013.01); H04B 10/66 (2013.01); H04B 10/677 (2013.01);
Abstract

Embodiments herein may relate to an optoelectronic receiver that includes a photonic integrated circuit (PIC) coupled with a light source. Respective PIC sections of the PIC may include a photodiode and a junction capacitor. The optoelectronic receiver may further include an electronic integrated circuit (EIC) coupled with the PIC. Respective EIC sections of the EIC may be communicatively coupled to respective ones of the PIC sections. Other embodiments may be described and/or claimed.


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