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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10604681 B1

PDFFull Text
Date of Patent:
Mar. 31, 2020

Filed:

Jun. 01, 2016

Solvent-free light-curable adhesive composition

Applicant:

Nissan Chemical Industries, Ltd., Tokyo, JP;

Inventors:

Daisuke Maeda, Funabashi, JP;

Naoya Nishimura, Funabashi, JP;

Assignee:

NISSAN CHEMICAL INDUSTRIES, LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Robert T Butcher

Int. Cl.
CPC ...
C09J 11/08 (2006.01); C09J 4/00 (2006.01); C09J 11/06 (2006.01); C09J 179/04 (2006.01); G02B 1/04 (2006.01); C08F 226/02 (2006.01); C09J 7/10 (2018.01); C09J 133/04 (2006.01); C08G 73/02 (2006.01); C09J 133/14 (2006.01); C09J 7/30 (2018.01); C08G 69/00 (2006.01); C08G 73/06 (2006.01); C09J 133/08 (2006.01); C09J 133/10 (2006.01); G02B 1/111 (2015.01); H01L 31/0216 (2014.01); C08K 5/3492 (2006.01); C08F 220/14 (2006.01); C08F 220/18 (2006.01); C08F 220/10 (2006.01);
U.S. Cl.
CPC ...
C09J 11/08 (2013.01); C08F 226/02 (2013.01); C08G 69/00 (2013.01); C08G 73/026 (2013.01); C08G 73/0273 (2013.01); C08G 73/0644 (2013.01); C09J 4/00 (2013.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 11/06 (2013.01); C09J 133/04 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C09J 133/14 (2013.01); C09J 179/04 (2013.01); G02B 1/04 (2013.01); G02B 1/111 (2013.01); H01L 31/0216 (2013.01); C08F 220/10 (2013.01); C08F 220/14 (2013.01); C08F 220/18 (2013.01); C08K 5/3492 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2205/31 (2013.01); C09J 2433/00 (2013.01);
Abstract

A solvent-free light-curable adhesive composition includes: for example, a triazine ring-containing polymer including a repeating unit structure represented by formula [3] and having a weight-average molecular weight of 500-5000; and a reactive diluent such as N-vinylformamide, the composition not including a solvent. The solvent-free light-curable adhesive composition has good compatibility with acrylic materials and the like, which are adhesive components, even without including a solvent.

Find Patent Forward Citations

Maeda, Daisuke. (2020). Solvent-free light-curable adhesive composition (U.S. Patent No. 10604681). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10604681

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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