The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Nov. 28, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventor:

Hui Liu, Dublin, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/32 (2006.01); H01L 25/18 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 35/00 (2006.01); H01L 35/30 (2006.01);
U.S. Cl.
CPC ...
H01L 35/32 (2013.01); H01L 23/3672 (2013.01); H01L 23/49816 (2013.01); H01L 25/18 (2013.01); H01L 35/00 (2013.01); H01L 35/30 (2013.01);
Abstract

A system includes an electronic device comprising one or more integrated circuit (IC) packages. The one or more IC packages include one or more IC chips and one or more thermoelectric power feedback systems. The one or more thermoelectric power feedback systems include one or more thermoelectric devices coupled to the one or more IC chips to generate power based on heat produced by the one or more IC chips. The one or more thermoelectric power feedback systems also include a power routing system that supplies the generated power to the one or more IC packages.


Find Patent Forward Citations

Liu, Hui. (2020). Package with thermoelectric power feedback loop (U.S. Patent No. 10600948). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10600948

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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