The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Feb. 01, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Xiangdong Chen, San Diego, CA (US);

Venugopal Boynapalli, San Marcos, CA (US);

Hyeokjin Lim, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/535 (2006.01); H01L 29/06 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 29/66 (2006.01); H01L 23/528 (2006.01); H01L 27/118 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0696 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/53209 (2013.01); H01L 27/0207 (2013.01); H01L 27/11807 (2013.01); H01L 29/0642 (2013.01); H01L 29/6656 (2013.01); H01L 29/66545 (2013.01); H01L 2027/11831 (2013.01); H01L 2027/11875 (2013.01);
Abstract

According to certain aspects of the present disclosure, a chip includes a first gate, a second gate, a first source, a first source contact disposed on the first source, a metal interconnect above the first source contact and the first gate, a first gate contact electrically coupling the first gate to the metal interconnect, and a first via electrically coupling the first source contact to the metal interconnect. The chip also includes a power rail, and a second via electrically coupling the first source contact to the power rail. The second gate is between the first source and the first gate, and the metal interconnect passes over the second gate.


Find Patent Forward Citations

Loading…