The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2020
Filed:
Mar. 28, 2017
Infineon Technologies Ag, Neubiberg, DE;
Ivan Penjovic, Munich, DE;
Oliver Nagler, Munich, DE;
Infineon Technologies AG, Neubiberg, DE;
Abstract
A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.