The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2020

Filed:

Oct. 31, 2014
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Shunki Sadamori, Saitama, JP;

Hiroshi Miyazawa, Saitama, JP;

Masafumi Ogata, Saitama, JP;

Keisuke Shinohara, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); H01H 1/02 (2006.01); H01R 13/03 (2006.01); C25D 3/46 (2006.01); C25D 3/12 (2006.01); C25D 5/12 (2006.01); C25D 5/34 (2006.01); C25D 17/10 (2006.01); C25D 17/12 (2006.01); C25D 5/50 (2006.01); C25F 1/00 (2006.01); C25D 7/00 (2006.01); H01B 1/02 (2006.01); C25D 7/06 (2006.01);
U.S. Cl.
CPC ...
C25D 3/46 (2013.01); C25D 3/12 (2013.01); C25D 5/12 (2013.01); C25D 5/34 (2013.01); C25D 5/50 (2013.01); C25D 17/10 (2013.01); C25D 17/12 (2013.01); C25F 1/00 (2013.01); H01H 1/02 (2013.01); H01R 13/03 (2013.01); C25D 7/00 (2013.01); C25D 7/0614 (2013.01); H01B 1/02 (2013.01);
Abstract

A silver-plated product, wherein the preferred orientation plane of a surface layer of silver is {111} plane and wherein the ratio of the full-width at half maximum of an X-ray diffraction peak on {111} plane after heating the silver-plated product at 50° C. for 168 hours to the full-width at half maximum of an X-ray diffraction peak on {111} plane before the heating of the silver-plated product is not less than 0.5, is produced by forming the surface layer on a base material by electroplating at a liquid temperature of 12 to 24° C. and a current density of 3 to 8 A/dmin a silver plating solution which contains 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium, so as to cause the product of the concentration of potassium cyanide and the current density to be 840 g·A/L·dmor less.


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