The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Jun. 07, 2019
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventors:
Isao Obu, Nagaokakyo, JP;
Yasunari Umemoto, Nagaokakyo, JP;
Masahiro Shibata, Nagaokakyo, JP;
Kenichi Nagura, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 1/52 (2006.01); H01L 23/00 (2006.01); H01L 29/04 (2006.01); H03F 3/213 (2006.01); H01L 29/737 (2006.01); H01L 27/02 (2006.01); H01L 27/06 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 29/205 (2006.01); H01L 29/06 (2006.01); H01L 21/265 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 23/48 (2006.01); H01L 29/861 (2006.01); H01L 21/768 (2006.01); H03F 3/195 (2006.01); H01L 21/02 (2006.01); H01L 29/36 (2006.01); H01L 29/207 (2006.01); H01L 29/45 (2006.01); H01L 21/285 (2006.01); H01L 21/3213 (2006.01); H01L 21/027 (2006.01); H01L 29/66 (2006.01); H01L 21/306 (2006.01); H01L 21/311 (2006.01); H03F 1/56 (2006.01); H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 21/8252 (2006.01);
U.S. Cl.
CPC ...
H03F 1/52 (2013.01); H01L 21/0217 (2013.01); H01L 21/0262 (2013.01); H01L 21/0274 (2013.01); H01L 21/02271 (2013.01); H01L 21/02546 (2013.01); H01L 21/2654 (2013.01); H01L 21/28575 (2013.01); H01L 21/30612 (2013.01); H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/32134 (2013.01); H01L 21/76895 (2013.01); H01L 21/76897 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 27/0248 (2013.01); H01L 27/0605 (2013.01); H01L 27/0652 (2013.01); H01L 29/045 (2013.01); H01L 29/0642 (2013.01); H01L 29/0692 (2013.01); H01L 29/0804 (2013.01); H01L 29/0817 (2013.01); H01L 29/0821 (2013.01); H01L 29/1004 (2013.01); H01L 29/205 (2013.01); H01L 29/207 (2013.01); H01L 29/36 (2013.01); H01L 29/41708 (2013.01); H01L 29/42304 (2013.01); H01L 29/452 (2013.01); H01L 29/66204 (2013.01); H01L 29/66242 (2013.01); H01L 29/66318 (2013.01); H01L 29/7371 (2013.01); H01L 29/861 (2013.01); H01L 29/8613 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/213 (2013.01); H01L 21/8252 (2013.01); H01L 23/291 (2013.01); H01L 23/3121 (2013.01); H01L 23/3171 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/16 (2013.01); H01L 27/0635 (2013.01); H01L 27/0664 (2013.01); H01L 29/0657 (2013.01); H01L 2224/0221 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0518 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05084 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85203 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/10337 (2013.01); H01L 2924/13051 (2013.01); H01L 2924/13063 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19043 (2013.01); H03F 2200/222 (2013.01); H03F 2200/387 (2013.01); H03F 2200/411 (2013.01); H03F 2200/426 (2013.01); H03F 2200/444 (2013.01); H03F 2200/451 (2013.01);
Abstract
A circuit element is formed on a substrate made of a compound semiconductor. A bonding pad is disposed on the circuit element so as to at least partially overlap the circuit element. The bonding pad includes a first metal film and a second metal film formed on the first metal film. A metal material of the second metal film has a higher Young's modulus than a metal material of the first metal film.
Obu, Isao. (2020). Semiconductor device and power amplifier module (U.S. Patent No. 10594271). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10594271
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile