The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
May. 31, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Praveen Kumar, Bangalore, IN;
Bijendra Singh, Bangalore, IN;
Saku Lahti, Tampere, FI;
Seppo Vesamaki, Tampere, FI;
Marko Bonden, Tampere, FI;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/00 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); F28F 21/04 (2006.01); F28F 21/06 (2006.01); H01Q 1/02 (2006.01); H01Q 1/42 (2006.01); H01R 24/40 (2011.01); H01Q 1/24 (2006.01); H01Q 1/44 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/002 (2013.01); F28D 15/0275 (2013.01); F28D 15/046 (2013.01); F28F 21/04 (2013.01); H01Q 1/243 (2013.01); H01Q 1/44 (2013.01); F28D 15/02 (2013.01); F28D 15/04 (2013.01); F28D 2021/0028 (2013.01);
Abstract
A heat pipe is provided that is adapted for use as part of an antenna. The heat pipe includes a first conductive shell portion; a second conductive shell portion; and an insulating shell portion disposed between and connected to the first conductive shell portion and the second conductive shell portion. A wick structure is disposed within the sealed chamber.