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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10593032 B1

PDFFull Text
Date of Patent:
Mar. 17, 2020

Filed:

Jan. 27, 2017

Defect inspection method and defect inspection apparatus

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sung-Yoon Ryu, Suwon-Si, KR;

Joon-Seo Song, Seoul, KR;

Yu-Sin Yang, Seoul, KR;

Chung-Sam Jun, Suwon-si, KR;

Yun-Jung Jee, Seongnam-si, KR;

Assignee:

Samsung Electronics Co., Ltd., , KR;

Attorney:

Onello & Mello, LLP

Primary Examiner:

Susan E Hodges

Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/88 (2006.01); G06K 9/00 (2006.01); G01B 11/00 (2006.01); G06T 7/00 (2017.01); G01N 21/956 (2006.01); H01L 21/66 (2006.01); G02B 21/00 (2006.01); G06T 7/11 (2017.01); G06T 7/174 (2017.01); G01N 23/2251 (2018.01); H01J 37/22 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); G01N 21/8851 (2013.01); G01N 21/9501 (2013.01); G01N 21/956 (2013.01); G01N 21/95607 (2013.01); G01N 23/2251 (2013.01); G02B 21/008 (2013.01); G02B 21/0016 (2013.01); G06T 7/11 (2017.01); G06T 7/174 (2017.01); H01J 37/22 (2013.01); G01N 2021/8867 (2013.01); G01N 2223/418 (2013.01); G01N 2223/6116 (2013.01); G02B 21/0036 (2013.01); G06T 2207/10061 (2013.01); G06T 2207/10144 (2013.01); G06T 2207/10148 (2013.01); G06T 2207/20212 (2013.01); G06T 2207/30148 (2013.01); H01J 2237/221 (2013.01); H01J 2237/226 (2013.01); H01J 2237/24578 (2013.01); H01J 2237/28 (2013.01); H01J 2237/2817 (2013.01);
Abstract

In a defect inspection method, first and second inspection conditions having a first sensitivity of detection signal and having a second sensitivity of a detection signal for a defect of interest (DOI), respectively, are determined. The first and second sensitivities are different. First and second images of the same detection region on a substrate surface under the first and second inspection conditions respectively, are obtained. The first and second images are matched to detect a defect in the detection region.

Find Patent Forward Citations

Ryu, Sung-Yoon. (2020). Defect inspection method and defect inspection apparatus (U.S. Patent No. 10593032). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10593032

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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