The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Jun. 29, 2017
Applicant:

Eternal Materials Co., Ltd., Kaohsiung, TW;

Inventors:

Po-Yu Huang, Kaohsiung, TW;

Chih-Min An, Kaohsiung, TW;

Chung-Jen Wu, Kaohsiung, TW;

Meng-Yen Chou, Kaohsiung, TW;

Chang-Hong Ho, Kaohsiung, TW;

Shun-Jen Chiang, Kaohsiung, TW;

Chung-Kai Cheng, Kaohsiung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 179/08 (2006.01); B32B 37/22 (2006.01); C08G 73/10 (2006.01); C08G 73/12 (2006.01); C08J 5/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
C09D 179/08 (2013.01); B32B 37/226 (2013.01); C08G 73/1042 (2013.01); C08G 73/122 (2013.01); C08J 5/18 (2013.01); H05K 3/282 (2013.01); H05K 3/285 (2013.01); B32B 2309/02 (2013.01); B32B 2310/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/08 (2013.01); B32B 2457/20 (2013.01); C08J 2379/08 (2013.01); H05K 3/287 (2013.01); H05K 2201/0154 (2013.01);
Abstract

A polyimide dry film including a carrier and a polyimide layer and a method of using the same are provided. The polyimide layer contains (a) a polyimide precursor or soluble polyimide and (b) a solvent. The solvent includes a hydrophilic solvent and a hydrophobic solvent and a weight ratio of the hydrophilic solvent to the hydrophobic solvent is in the range of about 0.05 to about 2. The polyimide dry film of the present invention has water absorbability, is relatively stable even in the presence of water, and has a non-sticky surface. The resulting polyimide has excellent physical properties and can be used in a process in which water or an aqueous solution is involved to form a coverlay with excellent physical properties.


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