The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2020

Filed:

Apr. 13, 2018
Applicant:

Ev Group E. Thallner Gmbh, St. Florian am Inn, AT;

Inventor:

Mustapha Chouiki, Linz, AT;

Assignee:

EV GROUP E. THALLNER GMBH, St. Florian am Inn, AT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 59/00 (2006.01); C08L 83/04 (2006.01); G03F 7/00 (2006.01); C08L 71/00 (2006.01); B29C 59/16 (2006.01); B82Y 40/00 (2011.01); B29K 83/00 (2006.01); B29K 85/00 (2006.01);
U.S. Cl.
CPC ...
B29C 59/005 (2013.01); C08L 71/00 (2013.01); C08L 83/04 (2013.01); G03F 7/0002 (2013.01); B29C 59/16 (2013.01); B29K 2083/00 (2013.01); B29K 2085/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

An embossing material that can be hardened and used for embossing lithography, comprised of a mixture of at least one polymerizable main component, and at least one secondary component. The invention also relates to a use of the embossing material for the primary forming of an embossing form.


Find Patent Forward Citations

Chouiki, Mustapha. (2020). Embossing compound for embossing lithography (U.S. Patent No. 10589457). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10589457

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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