The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Mar. 17, 2017
Applied Materials, Inc., Santa Clara, CA (US);
Jeonghoon Oh, Saratoga, CA (US);
Edwin C. Suarez, Fremont, CA (US);
Jason Garcheung Fung, Santa Clara, CA (US);
Eric Lau, Santa Clara, CA (US);
King Yi Heung, Santa Clara, CA (US);
Ashwin Murugappan Chockalingam, San Jose, CA (US);
Daniel Redfield, Morgan Hill, CA (US);
Charles C. Garretson, Sunnyvale, CA (US);
Thomas H. Osterheld, Mountain View, CA (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
A chemical mechanical polishing system includes a substrate support configured to hold a substrate, a polishing pad assembly include a membrane and a polishing pad portion having a polishing surface, a polishing pad carrier, and a drive system configured to cause relative motion between the substrate support and the polishing pad carrier. The polishing pad portion is joined to the membrane on a side opposite the polishing surface. The polishing surface has a width parallel to the polishing surface at least four times smaller than a diameter of the substrate. An outer surface of the polishing pad portion includes at least one recess and at least one plateau having a top surface that provides the polishing surface. The polishing surface has a plurality of edges defined by intersections between side walls of the at least one recess and a top surface of the at least one plateau.