The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Mar. 31, 2016
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Russell S. Aoki, Tacoma, WA (US);

Dimitrios Ziakas, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/14 (2006.01); H01L 21/768 (2006.01); H01L 21/8234 (2006.01); H01L 21/34 (2006.01); H01L 23/00 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5226 (2013.01); H01L 21/7682 (2013.01); H01L 21/823493 (2013.01); H01L 23/145 (2013.01); H01L 23/345 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5382 (2013.01); H01L 24/09 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Semiconductor packages with programmable routing pathways are disclosed. The semiconductor package may have a source trace that may be electrically coupled to two or more different electrical pathways, where any of the electrical pathways may be activated to provide an electrical connection between the source trace and one or more destination nodes. Each of the electrical pathways may have a corresponding metal well with a correspond airgap overlying the metal well, as well as corresponding heating elements. If a particular heating element is energized, the heating element may melt metal in a corresponding metal well and the molten metal may migrate by capillary action into the overlying airgap to complete an electrical connection between the source trace and a destination node.


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