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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10586758 B1

PDFFull Text
Date of Patent:
Mar. 10, 2020

Filed:

Dec. 11, 2018

Substrate-with-support

Applicant:

Shinko Electric Industries Co., Ltd., Nagano, JP;

Inventor:

Tetsuichiro Kasahara, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Ishwarbhai B Patel

Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H01L 23/49 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49582 (2013.01); H01L 21/565 (2013.01); H01L 23/3128 (2013.01); H01L 23/49586 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49894 (2013.01); H01L 24/32 (2013.01); H01L 24/49 (2013.01); H01L 24/97 (2013.01); H05K 1/028 (2013.01); H05K 1/0271 (2013.01); H05K 1/0298 (2013.01); H01L 21/561 (2013.01); H01L 23/49816 (2013.01); H01L 24/16 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83101 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01);
Abstract

A substrate-with-support includes: a substrate having a wiring area, an outer peripheral area provided on an outer peripheral side of the wiring area, and a plurality of support joint portions being provided on the outer peripheral area; and a support made of metal having an outer frame portion arranged to face the outer peripheral area and to expose the wiring area, and a plurality of protruding portions being provided on the outer frame portion, wherein the support joint portions and the protruding portions are joined to each other.

Find Patent Forward Citations

Kasahara, Tetsuichiro. (2020). Substrate-with-support (U.S. Patent No. 10586758). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10586758

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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