The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Aug. 17, 2016
Ulvac, Inc., Chigasaki-shi, Kanagawa, JP;
Takashi Kageyama, Chigasaki, JP;
Tetsuya Shimada, Chigasaki, JP;
Koji Takahashi, Chigasaki, JP;
Yuu Nakamuta, Chigasaki, JP;
Manabu Harada, Chigasaki, JP;
ULVAC, INC., Chigasaki-Shi, Kanagawa, JP;
Abstract
According to a mode of the present invention, a method of manufacturing an electronic component includes: preparing a component main-bodyincluding a first surface having an electrode-formed region having a plurality of bump electrodes, a second surface opposite to the first surface, and side peripheral surfaces connecting the first surface and the second surface; forming a mask section Mon at least a peripheral portion of the first surface, the mask section surrounding the electrode-formed region, a height of the mask section being equal to or more than a height of the plurality of bump electrodes; bonding the mask section of the first surface to an adhesive layeron a holder for holding a component; forming a protective filmon the component main-body, the protective film covering the second surface and the side peripheral surfaces; and removing the mask section Mfrom the first surface.