The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2020
Filed:
Sep. 12, 2018
Applicant:
Disco Corporation, Tokyo, JP;
Inventors:
Youngsuk Kim, Tokyo, JP;
Shoichi Kodama, Tokyo, JP;
Assignee:
DISCO CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/66 (2006.01); G01R 31/28 (2006.01); G01R 31/26 (2020.01); G01R 31/311 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02345 (2013.01); G01R 31/2601 (2013.01); G01R 31/2851 (2013.01); G01R 31/2858 (2013.01); H01L 21/2683 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); G01R 31/2831 (2013.01); G01R 31/311 (2013.01);
Abstract
A method of assessing a semiconductor substrate includes a sticking step of sticking a device layer of the semiconductor substrate to a support substrate, a thinning step of thinning the semiconductor substrate from a reverse side thereof to a thickness smaller than a finished thickness after the sticking step is carried out, and an assessing step of applying light to the semiconductor substrate from the reverse side thereof and measuring scattered light from the semiconductor substrate thereby to assess a property of the semiconductor substrate.