The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jul. 20, 2018
Applicant:

Uniflex Technology Inc., Taichung, TW;

Inventors:

Yi-Chun Liu, New Taipei, TW;

Ying-Hsing Chen, Taichung, TW;

Bo-Hua Chen, Miaoli County, TW;

Yuan-Chih Lee, Taoyuan, TW;

Assignee:

UNIFLEX Technology Inc., Taichung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/60 (2013.01);
Abstract

A package structure for a backlight module includes a flexible base film, a plurality of pads, a light-emitting component, a patterned circuit layer. The flexible base film includes a plurality of conductive vias, a first surface, and a second surface opposite to the first surface. The conductive vias connect the first surface and the second surface. In addition, a material of the flexible base film includes polyimide and white fillings. The pads are disposed on the first surface. The conductive vias are connected to the pads. The light-emitting component is disposed on the pads and electrically connected to the pads. The patterned circuit layer is disposed on the second surface and electrically connected to the conductive vias.


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