The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Jan. 14, 2018
Applicant:
Winbond Electronics Corp., Taichung, TW;
Inventor:
Ming-Chung Chiang, Taichung, TW;
Assignee:
Winbond Electronics Corp., Taichung, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/48 (2006.01); H01L 29/40 (2006.01); H01L 23/522 (2006.01); B82Y 99/00 (2011.01); B82Y 30/00 (2011.01); B82Y 10/00 (2011.01);
U.S. Cl.
CPC ...
H01L 23/48 (2013.01); H01L 21/4846 (2013.01); H01L 23/522 (2013.01); H01L 29/40 (2013.01); B82Y 10/00 (2013.01); B82Y 30/00 (2013.01); B82Y 99/00 (2013.01); H01L 2924/13091 (2013.01);
Abstract
An interconnect structure including a conductive layer, a spacer, a dielectric layer, and a contact is provided. The conductive layer is disposed on a substrate. The spacer is disposed on a sidewall of the conductive layer. The dielectric layer covers the conductive layer and the spacer. The contact is disposed in the dielectric layer and located on the conductive layer.