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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10580689 B1

PDFFull Text
Date of Patent:
Mar. 03, 2020

Filed:

Dec. 28, 2017

Contact module for optimizing emitter and contact resistance

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

James W. Adkisson, Jericho, VT (US);

Anthony K. Stamper, Burlington, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:

David Cain

Andrew M. Calderon

Roberts Mlotkowski Safran Cole & Calderon, P.C.

Primary Examiner:

Hoang-Quan Ho

Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/732 (2006.01); H01L 29/737 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01); H01L 27/06 (2006.01); H01L 23/485 (2006.01); H01L 21/768 (2006.01); H01L 21/8249 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76814 (2013.01); H01L 21/02063 (2013.01); H01L 21/8249 (2013.01); H01L 27/0623 (2013.01); H01L 29/0821 (2013.01); H01L 29/1004 (2013.01); H01L 29/42304 (2013.01); H01L 29/66272 (2013.01); H01L 29/66318 (2013.01); H01L 29/732 (2013.01); H01L 29/7371 (2013.01); H01L 23/485 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An advanced contact module for optimizing emitter and contact resistance and methods of manufacture are disclosed. The method includes forming a first contact via to a first portion of a first device. The method further includes filling the first contact via with metal material to form a first metal contact to the first portion of the first device. The method further includes forming additional contact vias to other portions of the first device and contacts of a second device. The method further includes cleaning the additional contact vias while protecting the first metal contact of the first portion of the first device. The method further includes filling the additional contact vias with metal material to form additional metal contacts to the other portions of the first device and the second device.

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