The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Mar. 08, 2017
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Tsutomu Maeda, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B23K 26/00 (2014.01); H01L 21/687 (2006.01); B23K 26/53 (2014.01); B23K 26/03 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67092 (2013.01); B23K 26/032 (2013.01); B23K 26/53 (2015.10); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08);
Abstract

A controller of a laser processing apparatus includes: a storage section that stores processing conditions for forming modified layers along division lines of a wafer; and a processing line calculation section that displays a position at which the modified layer is planned to be formed and which is stored as the processing condition, on a display panel as a processing line. The processing line calculation section displays the processing line on the display panel superimposed on a first division line, in a region in which a start point or end point of the first division line is connected to a second division line. A start point or end point of a first modified layer formed along the first division line is permitted to be re-set on the display panel so as not to interfere with a second modified layer formed along the second division line.


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